Toshiba Ends Cooperation with Chinese Wafer Maker
Toshiba has scrapped its power semiconductor cooperation with a Chinese wafer maker due to economic security considerations.
The decision to end the technology pact was reportedly driven by concerns over economic security.
Despite ending the agreement, Toshiba's power semiconductor subsidiary will continue to source wafers from the Chinese company, SICC.
© Reuters
Toshiba's move comes amid apparent economic security concerns over the deal, as reported by Nikkei.
Author's summary: Toshiba ends tech pact with Chinese wafer maker.
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