InPsytech Showcases 3nm UCIe 3.0 Technology
InPsytech, a subsidiary of Egis Technology, announced its participation in the Open Compute Project (OCP) Global Summit 2025.
The company will showcase its latest 3nm UCIe high-speed interface technology demo, featuring support for the newest UCIe 3.0 standard, 3D packaging integration, and ultra-high-speed, low-power performance.
This demonstration highlights InPsytech's advanced R&D capabilities in Chiplet interconnect technology and its role in supporting Egis Group's broader strategy in semiconductor design and heterogeneous integration.
No specific quotes are provided in the given text.
Author's summary: InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025.
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